US 12,149,311 B2
Spatial thermal density reduction for MMWAVE antenna arrays
Oner Orhan, San Jose, CA (US); Brent Elliott, Hillsboro, OR (US); Hosein Nikopour, San Jose, CA (US); Eren Sasoglu, Mountain View, CA (US); and Shilpa Talwar, Cupertino, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on May 26, 2022, as Appl. No. 17/825,906.
Application 17/825,906 is a continuation of application No. 17/052,678, granted, now 11,349,539, previously published as PCT/US2018/040441, filed on Jun. 29, 2018.
Prior Publication US 2022/0337297 A1, Oct. 20, 2022
Int. Cl. H04B 7/06 (2006.01); H04B 1/44 (2006.01); H04B 7/0456 (2017.01)
CPC H04B 7/0608 (2013.01) [H04B 1/44 (2013.01); H04B 7/0456 (2013.01); H04B 7/0617 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wireless communication device comprising:
an antenna array;
a plurality of radio frequency front end (RFFE) circuit elements coupled to the antenna array-via at corresponding respective transmit and/or receive (TX/RX) chains;
a first thermal sensor coupled to a first RFFE circuit element of the plurality of RFFE circuit elements;
a second thermal sensor coupled to a second RFFE circuit element of the plurality of RFFE circuit elements; and
one or more processors configured to
receive respective temperature measurements from the first thermal sensor and the second thermal sensor, and
adjust a collective power of the respective TX/RX chains based on the respective temperature measurements.