US 12,149,224 B2
Bulk acoustic wave resonator on multi-layer piezoelectric substrate acoustic wave device
Keiichi Maki, Suita (JP); Hironori Fukuhara, Ibaraki (JP); and Rei Goto, Osaka (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Nov. 18, 2020, as Appl. No. 16/951,483.
Claims priority of provisional application 62/938,556, filed on Nov. 21, 2019.
Claims priority of provisional application 62/938,544, filed on Nov. 21, 2019.
Claims priority of provisional application 62/938,539, filed on Nov. 21, 2019.
Prior Publication US 2021/0159876 A1, May 27, 2021
Int. Cl. H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/13 (2006.01); H03H 9/145 (2006.01); H03H 9/17 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H03H 9/72 (2006.01); H04B 1/38 (2015.01)
CPC H03H 9/02574 (2013.01) [H03H 9/02015 (2013.01); H03H 9/02102 (2013.01); H03H 9/02228 (2013.01); H03H 9/02834 (2013.01); H03H 9/105 (2013.01); H03H 9/132 (2013.01); H03H 9/145 (2013.01); H03H 9/173 (2013.01); H03H 9/175 (2013.01); H03H 9/25 (2013.01); H03H 9/6406 (2013.01); H03H 9/6443 (2013.01); H03H 9/6483 (2013.01); H03H 9/725 (2013.01); H04B 1/38 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An acoustic wave filter component comprising:
a multi-layer piezoelectric substrate acoustic wave device that is a boundary wave resonator including a first support substrate, a first piezoelectric layer on the first support substrate, and an interdigital transducer electrode on the first piezoelectric layer;
a second support substrate over the interdigital transducer electrode;
a temperature compensation layer located between the interdigital transducer electrode and the second support substrate; and
a bulk acoustic wave resonator supported by the second support substrate, the bulk acoustic wave resonator including a second piezoelectric layer and electrodes on opposing sides of the second piezoelectric layer.