| CPC H01Q 9/0407 (2013.01) [H01Q 1/2283 (2013.01); H01Q 5/314 (2015.01)] | 9 Claims |

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1. An antenna module comprising:
an element body including a first antenna element; and
a plurality of solder balls provided on a surface of the element body,
wherein the plurality of solder balls are disposed at intersections between a plurality of row virtual lines extending in a first direction on the surface of the element body and arranged in a second direction perpendicular to the first direction and a plurality of column virtual lines extending in the second direction on the surface of the element body and arranged in the first direction,
wherein the plurality of row virtual lines include first to third row virtual lines arranged in this order in the second direction,
wherein the plurality of column virtual lines include first to third column virtual lines arranged in this order in the first direction,
wherein the plurality of solder balls include a first signal ball disposed at an intersection between the second row virtual line and the second column virtual line and coupled to the first antenna element and a plurality of ground balls for supplying a ground potential,
wherein the plurality of ground balls include first to fourth ground balls disposed,
wherein the first ground ball is disposed at an intersection between the first row virtual line and the second column virtual line,
wherein the second ground ball is disposed at an intersection between the second row virtual line and the first column virtual line,
wherein the third ground ball is disposed at an intersection between the second row virtual line and the third column virtual line,
wherein the fourth ground ball is disposed at an intersection between the third row virtual line and the second column virtual line,
wherein no ground ball is disposed at least at some of an intersection between the first row virtual line and the first column virtual line, an intersection between the first row virtual line and the third column virtual line, an intersection between the third row virtual line and the first column virtual line, and an intersection between the third row virtual line and the third column virtual line, and
wherein no solder ball is disposed, out of the intersections between the plurality of row and column virtual lines, at least at some of the plurality of intersections other than those at which the first signal ball or first to fourth ground balls are disposed.
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