| CPC H01Q 21/24 (2013.01) [H01Q 5/307 (2015.01)] | 16 Claims |

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1. An electronic device comprising:
a housing;
a wireless communication module; and
an antenna module operatively connected to the wireless communication module and disposed inside the housing,
wherein the antenna module comprises:
a first substrate comprising at least one feed line, a first surface disposed in a first direction, and a second surface disposed in a second direction opposite the first surface;
a second substrate disposed on the first surface of the first substrate and having a first antenna array and a second antenna array disposed on the second substrate; and
a third substrate disposed in a portion of the second surface of the first substrate and having a third antenna array and a fourth antenna array disposed on the third substrate,
wherein the second substrate and/or the third substrate is formed of a material having a higher permittivity than the first substrate.
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