US 12,148,985 B2
Antenna module having plurality of printed circuit boards laminated therein, and electronic device comprising same
Eunseok Hong, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Nov. 19, 2021, as Appl. No. 17/531,104.
Application 17/531,104 is a continuation of application No. 17/330,854, filed on May 26, 2021, granted, now 11,183,753, issued on Nov. 23, 2021.
Application 17/330,854 is a continuation of application No. PCT/KR2020/001233, filed on Jan. 23, 2020.
Claims priority of application No. 10-2019-0009284 (KR), filed on Jan. 24, 2019.
Prior Publication US 2022/0077576 A1, Mar. 10, 2022
Int. Cl. H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 7/00 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01); H01Q 21/28 (2006.01)
CPC H01Q 1/38 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 7/00 (2013.01); H01Q 9/0414 (2013.01); H01Q 21/065 (2013.01); H01Q 21/28 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A portable communication device comprising:
a housing;
a first printed circuit board (PCB) including:
a first surface and a second surface opposite to each other; and
at least one insulating layer located between the first surface and the second surface; and
a second PCB electrically connected with and contacted with the first PCB via a plurality of solders, the second PCB including:
a third surface and a fourth surface opposite to each other;
three or more insulating layers located between the third surface and the fourth surface, the three or more insulating layers including a first insulating layer, a second insulating layer and a third insulating layer, wherein the second insulating layer is located between the first insulating layer and the third insulating layer;
a first antenna array configured to radiate a first beam using a first millimeter wave frequency band, the first antenna array including a first antenna element located on the second insulating layer and a second antenna element located on the third insulating layer; and
a second antenna array configured to radiate a second beam using a second millimeter wave frequency band,
wherein the second insulating layer is located between the first antenna element and the second antenna element, and
wherein the second insulating layer is thicker than each insulating layer of the at least one insulating layer of the first PCB.