US 12,148,980 B2
Semiconductor device package and method of manufacturing the same
Christophe Zinck, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jun. 17, 2021, as Appl. No. 17/351,056.
Prior Publication US 2022/0407215 A1, Dec. 22, 2022
Int. Cl. H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01P 3/08 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01P 3/08 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a substrate comprising a feeding element;
a waveguide component disposed over the substrate; and
an antenna pattern disposed over the substrate, wherein the waveguide component is substantially aligned with the feeding element and the antenna pattern,
wherein a projection of the waveguide component on the substrate is around a periphery of a projection of the antenna pattern on the substrate, and
wherein the waveguide component comprises a plurality of conductive structures spaced apart from each other.