CPC H01M 10/486 (2013.01) [H01M 50/569 (2021.01); H01M 2220/20 (2013.01); H01R 13/00 (2013.01)] | 21 Claims |
1. A sampling component, comprising:
a circuit board, wherein the circuit board comprises a signal collecting portion and an insulation film connected to the signal collecting portion; and
a connecting part, wherein the connecting part comprises a body portion and a connecting portion, the body portion is connected to the connecting portion, and the connecting portion is electrically connected to the signal collecting portion;
wherein, the signal collecting portion of the circuit board is not electrically connected with the connecting portion of the connecting part by welding,
in a height direction, the connecting portion comprises a first connecting section and a second connecting section, and the first connecting section is connected to the second connecting section;
in the height direction, at least a part of the signal collecting portion is located between the first connecting section and the second connecting section; and
wherein the connecting part further comprises a buffer portion, and the buffer portion is connected to the connecting portion and the body portion, and the buffer portion comprises a plurality of bend structures, and each of the plurality of bend structures protrudes in the height direction.
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