US 12,148,870 B2
LED package and integrated light emitting device
Motokazu Yamada, Tokushima (JP); Yuichi Yamada, Anan (JP); Shinsaku Ikuta, Tokushima (JP); and Takeshi Tamura, Tokushima (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Oct. 28, 2022, as Appl. No. 18/050,896.
Application 18/050,896 is a continuation of application No. 17/103,719, filed on Nov. 24, 2020, granted, now 11,489,097.
Claims priority of application No. 2019-217545 (JP), filed on Nov. 29, 2019; and application No. 2020-141081 (JP), filed on Aug. 24, 2020.
Prior Publication US 2023/0096212 A1, Mar. 30, 2023
Int. Cl. H01L 33/60 (2010.01); F21V 3/06 (2018.01); H01L 33/54 (2010.01); F21Y 105/16 (2016.01); F21Y 115/10 (2016.01)
CPC H01L 33/60 (2013.01) [F21V 3/062 (2018.02); H01L 33/54 (2013.01); F21Y 2105/16 (2016.08); F21Y 2115/10 (2016.08)] 14 Claims
OG exemplary drawing
 
1. An LED package comprising:
a light source having an upper face serving as a light emission face, the light source including
a resin package including a first lead, a second lead, and a resin member supporting the first lead and the second lead, the resin package defining a recess having
a bottom face defined by a portion of the first lead, a portion of the second lead, and a portion of the resin member, and
a lateral wall defined by a portion of the resin member,
a light emitting element disposed on or above the bottom face in the recess, and
a wavelength conversion material disposed within the recess so as to be surrounded by the lateral wall of the recess;
a light transmissive member disposed on or above the resin package of the light source so that the light transmissive member is disposed on or above the wavelength conversion material of the light source; and
a light reflecting layer disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.