US 12,148,867 B2
Light-emitting device and displayer
Kuai Qin, Guangdong (CN); Heng Guo, Guangdong (CN); Xiaobo Ouyang, Guangdong (CN); Hongwen Chen, Guangdong (CN); Qiang Zhao, Guangdong (CN); Bin Cai, Guangdong (CN); Nianpu Li, Guangdong (CN); and Junyong Wang, Guangdong (CN)
Assigned to FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD, Foshan (CN)
Filed by FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD, Foshan (CN)
Filed on Jan. 13, 2022, as Appl. No. 17/574,586.
Claims priority of application No. 202120105789.2 (CN), filed on Jan. 15, 2021; and application No. 202110572473.9 (CN), filed on May 25, 2021.
Prior Publication US 2022/0231206 A1, Jul. 21, 2022
Int. Cl. H01L 33/56 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01)
CPC H01L 33/56 (2013.01) [H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/10155 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13609 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13613 (2013.01); H01L 2224/13616 (2013.01); H01L 2224/13617 (2013.01); H01L 2224/1362 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/12041 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A light-emitting device, comprising a substrate and a light-emitting chip, the light-emitting chip is arranged on the substrate in a bonding mode, wherein the light-emitting device further comprises a first light-transmitting layer, a second light-transmitting layer and a nano coating, wherein a light transmittance of the second light-transmitting layer is greater than a light transmittance of the first light-transmitting layer;
a reference surface corresponding to the light-emitting chip is arranged above the substrate, the reference surface is higher than a bottom surface of the light-emitting chip and the reference surface is not higher than a top surface of the light-emitting chip;
an exposed surface of the light-emitting chip is divided into an upper surface and a lower surface based on the reference surface;
the lower surface is covered by the first light-transmitting layer, and the upper surface is covered by the second light-transmitting layer;
the first light-transmitting layer and the second light-transmitting layer are is closely arranged at a position of the reference surface; and
the nano coating covering an outer surface of the first light-transmitting layer, an outer surface of the second light-transmitting layer and a side surface of the substrate;
the light-emitting device is formed by cutting a module, the module comprising a circuit board, a plurality of the light-emitting chips and a packaging material, wherein the substrate of the light-emitting device is at least a part of the circuit board, the light-emitting chip of the light-emitting device is at least one of a plurality of the light-emitting chips of the module, and the first light-transmitting layer, the second light-transmitting layer and the nano coating of the light-emitting device is at least a part of the packaging material of the module;
the circuit board is provided with a bonding pad, the light-emitting chip is provided with an electrode;
the electrode is bonded to a corresponding bonding pad based on a connection structure;
the connection structure comprising a connection ball and solder, the connection ball is bonded to the bonding pad, the solder covering the connection ball and the bonding pad, and the electrode is bonded with a corresponding connection ball and the bonding pad through the solder; and
the packaging material covering the light-emitting chip and encapsulating the light-emitting chip on the circuit board;
the connection structure further comprises a reinforcing wire, both ends of the reinforcing wire are respectively bonded to the corresponding connection ball and the bonding pad.