US 12,148,848 B2
Photoelectric conversion apparatus and manufacturing method therefor
Masashi Kusukawa, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Mar. 31, 2021, as Appl. No. 17/218,377.
Claims priority of application No. 2020-069146 (JP), filed on Apr. 7, 2020.
Prior Publication US 2021/0313477 A1, Oct. 7, 2021
Int. Cl. H01L 27/146 (2006.01); H01L 31/0392 (2006.01)
CPC H01L 31/03921 (2013.01) [H01L 27/14643 (2013.01); H01L 27/14698 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A photoelectric conversion apparatus, comprising:
a semiconductor substrate having a first surface and a second surface opposite to the first surface;
a plurality of photoelectric conversion regions including an impurity of a first conductivity type and arranged at the semiconductor substrate;
a trench arranged between the plurality of photoelectric conversion regions;
a first impurity region including an impurity of a second conductivity type opposite to the first conductivity type and arranged along the first surface and a sidewall of the trench;
a second impurity region including the impurity of the second conductivity type and arranged along the first surface, the sidewall of the trench, and a bottom of the trench; and
a first film arranged at the first surface and the sidewall of the trench,
wherein a first impurity concentration of the impurity of the second conductivity type in the first impurity region is higher than a second impurity concentration of the impurity of the second conductivity type in the second impurity region and a maximum distance between the first surface and the first impurity region is smaller than a maximum distance between the first surface and a part of the second impurity region arranged along the sidewall of the trench,
wherein the maximum distance between the first surface and the first impurity region is larger than a distance between the first surface and another part of the second impurity region arranged along the first surface, and
wherein a maximum distance between the sidewall of the trench and an outer sidewall of the first impurity region is larger than a maximum distance between the sidewall of the trench and an outer sidewall of the part of the second impurity region.