| CPC H01L 29/78696 (2013.01) [H01L 21/26513 (2013.01); H01L 21/28088 (2013.01); H01L 21/28185 (2013.01); H01L 21/28202 (2013.01); H01L 21/28238 (2013.01); H01L 21/324 (2013.01); H01L 29/0653 (2013.01); H01L 29/0673 (2013.01); H01L 29/0847 (2013.01); H01L 29/1054 (2013.01); H01L 29/42364 (2013.01); H01L 29/42392 (2013.01); H01L 29/4966 (2013.01); H01L 29/66545 (2013.01); H01L 29/66636 (2013.01)] | 20 Claims |

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1. A semiconductor device, comprising:
a silicon germanium channel over a substrate;
a germanium-free interfacial layer over the silicon germanium channel;
a high-k dielectric layer over the germanium-free interfacial layer;
a metal gate electrode over the high-k dielectric layer; and
a high-k passivation layer interposing the high-k dielectric layer and the germanium-free interfacial layer, wherein the high-k passivation layer has a concentration gradient of silicate.
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