US 12,148,787 B2
Image sensor and electronic apparatus
Yoshihiko Nagahama, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/284,699
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
PCT Filed Oct. 15, 2019, PCT No. PCT/JP2019/040372
§ 371(c)(1), (2) Date Apr. 12, 2021,
PCT Pub. No. WO2020/080327, PCT Pub. Date Apr. 23, 2020.
Claims priority of application No. 2018-195638 (JP), filed on Oct. 17, 2018.
Prior Publication US 2021/0343776 A1, Nov. 4, 2021
Int. Cl. H01L 27/146 (2006.01); H04N 25/76 (2023.01); H04N 25/778 (2023.01); H04N 25/79 (2023.01)
CPC H01L 27/14641 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/1464 (2013.01); H01L 27/14645 (2013.01); H01L 27/1469 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An image sensor comprising:
a first substrate having a plurality of photoelectric transducers formed on the first substrate;
a second substrate having a pixel transistor for each of sets of two or more of the photoelectric transducers as a constituent unit, the pixel transistor being shared by the set and formed on the second substrate; and
a second wiring which is connected to a first wiring formed on the second substrate via one contact, and is connected to a plurality of first elements, the first wiring leading to a second element shared by a plurality of first elements among a plurality of elements formed on the first substrate, each of the plurality of first elements being formed for each of the photoelectric transducers.