US 12,148,786 B2
Electronic detection interface and electronic detection module using the same
Hsien-Te Chen, Taipei (TW)
Assigned to ULTRA DISPLAY TECHNOLOGY CORP., Taipei (TW)
Filed by ULTRA DISPLAY TECHNOLOGY CORP., Taipei (TW)
Filed on Nov. 9, 2023, as Appl. No. 18/505,463.
Application 18/505,463 is a continuation of application No. 16/992,838, filed on Aug. 13, 2020, granted, now 11,888,011.
Claims priority of application No. 108129149 (TW), filed on Aug. 15, 2019.
Prior Publication US 2024/0079438 A1, Mar. 7, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 31/062 (2012.01); G01R 31/26 (2020.01); H01L 27/146 (2006.01); H01L 31/113 (2006.01)
CPC H01L 27/14636 (2013.01) [G01R 31/2635 (2013.01); G01R 31/2648 (2013.01); H01L 27/14603 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips, comprising:
a substrate structure including a circuit layer, wherein the circuit layer comprises a plurality of circuit units in array; and
a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips, wherein the detection units are disposed on a surface of the substrate structure and are corresponded to the circuit units in a respect manner, and each of the detection units includes at least one resilient conductive pillar electrically connected to each of the circuit units,
wherein each of the resilient conductive pillars comprises a non-conductive photoresist and a conductive layer entirely covering the non-conductive photoresist.