CPC H01L 27/1463 (2013.01) [H01L 27/14612 (2013.01); H01L 27/14614 (2013.01); H01L 27/14636 (2013.01); H01L 27/1464 (2013.01); H01L 27/14643 (2013.01); H01L 27/14645 (2013.01); H01L 27/14689 (2013.01)] | 20 Claims |
1. A method of forming an integrated chip, comprising:
forming a gate stack over a front surface of a semiconductor substrate;
forming a mask layer over at least a portion of the gate stack and a portion of the front surface; and
implanting a plurality of dopants into one or more regions of the semiconductor substrate that are not covered by the mask layer to form one or more doped isolation features in the semiconductor substrate, wherein the plurality of dopants are implanted into the one or more regions of the semiconductor substrate after forming the mask layer over the gate stack.
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