CPC H01L 27/1288 (2013.01) [H01L 27/1248 (2013.01); H01L 29/78633 (2013.01)] | 10 Claims |
1. An electronic device, comprising:
a substrate with a step structure comprising a high-level surface and a low-level surface, wherein the substrate comprises a base, an insulating layer disposed on the base, and a metal layer, and the insulating layer has a first opening exposing a first portion of the metal layer; and
a pattern layer comprising a first unit pattern and a second unit pattern adjacent to and separated from the first unit pattern,
wherein the first unit pattern overlaps a first part of the low-level surface and overlaps a first part of the high-level surface, and the second unit pattern overlaps a second part of the low-level surface and overlaps a second part of the high-level surface,
wherein the first part of the low-level surface comprises the first portion of the metal layer.
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