| CPC H01L 25/167 (2013.01) [H01L 23/481 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01)] | 9 Claims |

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1. A semiconductor device, comprising:
a first semiconductor substrate;
a light emitting element on a first surface of the first semiconductor substrate;
a drive circuit on a second surface of the first semiconductor substrate, wherein the drive circuit is configured to drive the light emitting element;
a first through electrode and a second through electrode that penetrate the first semiconductor substrate, wherein
the first through electrode and the second through electrode electrically connect the drive circuit with the light emitting element, and
the light emitting element on the first surface of the first semiconductor substrate straddles the first through electrode and the second through electrode that penetrate the first semiconductor substrate;
a first electrode on a first side of the light emitting element, wherein
the first through electrode and the second through electrode are electrically connected to the first electrode, and
the first electrode is on the first surface of the first semiconductor substrate;
a second electrode on a second side of the light emitting element, wherein the first electrode faces the second electrode; and
a third electrode on the first surface of the first semiconductor substrate, wherein the second electrode is electrically connected to the third electrode.
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