US 12,148,742 B2
Active bridge enabled co-packaged photonic transceiver
Thomas Liljeberg, San Jose, CA (US); Andrew C. Alduino, San Jose, CA (US); Ravindranath Vithal Mahajan, Chandler, AZ (US); Ling Liao, Fremont, CA (US); Kenneth Brown, Tempe, AZ (US); James Jaussi, El Dorado Hills, CA (US); Bharadwaj Parthasarathy, San Jose, CA (US); and Nitin A Deshpande, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 12, 2020, as Appl. No. 16/816,669.
Prior Publication US 2021/0288035 A1, Sep. 16, 2021
Int. Cl. G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 25/16 (2023.01); H04B 10/40 (2013.01)
CPC H01L 25/167 (2013.01) [G02B 6/4268 (2013.01); G02B 6/428 (2013.01); H01L 23/3675 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H04B 10/40 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A microelectronic package, comprising:
a package substrate comprising a bridge;
a die coupled with the package substrate, wherein the die is communicatively coupled with the bridge; and
a photonic integrated circuit (PIC) communicatively coupled with the bridge,
wherein the bridge is to facilitate communication between the die and the PIC without a retimer, the bridge includes a circuit element that is to alter a signal that is to propagate through the bridge, and the circuit element is an element of an electronic integrated circuit (EIC) of a photonic transceiver that includes the PIC.