US 12,148,741 B2
Sidewall connections and button interconnects for molded SiPs
Bilal Mohamed Ibrahim Kani, Singapore (SG); Ali N. Ergun, Sunnyvale, CA (US); Kishore N. Renjan, Singapore (SG); Kyusang Kim, Singapore (SG); Manoj Vadeentavida, Singapore (SG); Benjamin J. Grena, San Francisco, CA (US); David M. Kindlon, Felton, CA (US); and Lan H. Hoang, Los Gatos, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jun. 10, 2022, as Appl. No. 17/806,412.
Application 17/806,412 is a continuation in part of application No. 17/407,670, filed on Aug. 20, 2021, granted, now 11,765,838.
Prior Publication US 2023/0056922 A1, Feb. 23, 2023
Int. Cl. H05K 1/02 (2006.01); G01D 11/24 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01R 12/59 (2011.01); H01R 12/62 (2011.01); H01R 12/79 (2011.01); H01R 13/6581 (2011.01); H01R 43/20 (2006.01); H05K 1/18 (2006.01); H05K 3/14 (2006.01); H05K 3/18 (2006.01); H10K 59/131 (2023.01)
CPC H01L 25/162 (2013.01) [G01D 11/245 (2013.01); H01L 21/56 (2013.01); H01L 23/315 (2013.01); H01L 23/4985 (2013.01); H01L 25/165 (2013.01); H01R 12/592 (2013.01); H01R 12/62 (2013.01); H01R 12/79 (2013.01); H01R 13/6581 (2013.01); H01R 43/205 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic module comprising:
a system-in-package including:
a routing substrate;
a first electronic component mounted on a first side of the routing substrate and encapsulated in a first molding compound layer; and
a socket connector housing mounted on the routing substrate and within a cavity in the first molding compound layer, the socket connector housing including a side receptacle opening;
wherein the cavity is exposed along a first side surface of the first molding compound layer;
a flexible circuit extending into the cavity from outside the first molding compound layer and connected inside the side receptacle opening of the socket connector housing.