US 12,148,740 B2
Display devices
Yuan-Lin Wu, Miao-Li County (TW); Kuan-Feng Lee, Miao-Li County (TW); and Wei-Cheng Chu, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Apr. 24, 2023, as Appl. No. 18/305,509.
Application 18/305,509 is a continuation of application No. 17/110,449, filed on Dec. 3, 2020, abandoned.
Application 17/110,449 is a continuation of application No. 16/410,114, filed on May 13, 2019, granted, now 10,886,259, issued on Jan. 5, 2021.
Application 16/410,114 is a continuation of application No. 15/593,626, filed on May 12, 2017, granted, now 10,340,256, issued on Jul. 2, 2019.
Claims priority of provisional application 62/394,225, filed on Sep. 14, 2016.
Claims priority of provisional application 62/429,162, filed on Dec. 2, 2016.
Claims priority of provisional application 62/465,869, filed on Mar. 2, 2017.
Prior Publication US 2023/0268326 A1, Aug. 24, 2023
Int. Cl. H01L 25/075 (2006.01); H01L 33/20 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 33/20 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A display device, comprising:
a substrate comprising a display area;
a plurality of light-emitting diodes having a bottom disposed on the display area of the substrate, wherein at least one of the plurality of light-emitting diodes comprises an electrode and an insulating layer, and the insulating layer directly connects adjacent two of the plurality of light-emitting diodes;
a plurality of bonding pads disposed on the substrate;
a conductive element having a maximum height disposed between one of the plurality of bonding pads and the electrode of the at least one of the plurality of light-emitting diodes; a first matrix element disposed on the substrate,
wherein in a cross-sectional view, the first matrix element is disposed between adjacent two of the plurality of light-emitting diodes, and the electrode has a sidewall profile and at least a part of the sidewall profile of the electrode is in a shape of a curve; and
an array layer disposed on the substrate,
wherein the first matrix element is disposed between adjacent two of the plurality of bonding pads, and the first matrix element and the bonding pads are on the same level plane, and a distance between the array layer and the bottom of the light-emitting diode is greater than the maximum height of the conductive element.