US 12,148,730 B2
In-process wire bond testing using wire bonding apparatus
Ben Carlson-Sypek, Chandler, AZ (US); DodgieReigh M. Calpito, Fairfield, CA (US); and Ryan Simpson, Maricopa, AZ (US)
Assigned to Atieva, Inc., Newark, CA (US)
Filed by Atieva, Inc., Newark, CA (US)
Filed on Dec. 30, 2021, as Appl. No. 17/646,586.
Prior Publication US 2023/0215835 A1, Jul. 6, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/66 (2006.01)
CPC H01L 24/78 (2013.01) [H01L 22/14 (2013.01); H01L 24/85 (2013.01); H01L 2224/7855 (2013.01); H01L 2224/78611 (2013.01); H01L 2224/789 (2013.01); H01L 2224/851 (2013.01); H01L 2224/859 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A wire bonding apparatus comprising:
a supply of bond wire;
a wire bonding head including a wire cutter, the wire cutter being electrically conductive; and
an electrical continuity tester coupled between the supply of bond wire and the wire cutter, wherein the wire bonding apparatus is configured to:
after forming a wire bond on a contact surface, electrically contact the contact surface with the wire cutter; and
with the wire cutter electrically contacting the contact surface, measure a resistance between the contact surface and the supply of bond wire with the electrical continuity tester.