US 12,148,726 B2
Semiconductor substrate structure, semiconductor structure and manufacturing method thereof
Dyi-Chung Hu, Hsinchu County (TW)
Filed by Dyi-Chung Hu, Hsinchu County (TW)
Filed on Feb. 27, 2024, as Appl. No. 18/587,993.
Application 18/587,993 is a continuation in part of application No. 17/979,793, filed on Nov. 3, 2022, granted, now 11,948,899.
Claims priority of provisional application 63/275,914, filed on Nov. 4, 2021.
Claims priority of application No. 111138748 (TW), filed on Oct. 13, 2022.
Prior Publication US 2024/0203921 A1, Jun. 20, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/13 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 24/05 (2013.01); H01L 25/0652 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13026 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor substrate structure, comprising:
a first group of circuit structure, comprising a plurality of first wiring layers and a plurality of first conductive connectors, wherein each of the first conductive connectors comprises a conductive cap;
a second group of circuit structure, comprising a plurality of second wiring layers and a plurality of second conductive connectors, wherein the first group of circuit structure and the second group of circuit structure are electrically connected through bonding of the first conductive connectors and the second conductive connectors to form a multilayer redistribution structure, a number of the first wiring layers of the first group of circuit structure is the same as a number of the second wiring layers of the second group of circuit structure; and
a first device, wherein:
the first device is disposed on the first group of circuit structure and electrically connected to portion of the first conductive connectors; or
the first device is disposed on the second group of circuit structure and electrically connected to portion of the second conductive connectors.