US 12,148,725 B2
Bonding structures and methods for forming the same
Tung-Han Chuang, Hsinchu (TW); and Hsing-Hua Tsai, Hsinchu (TW)
Assigned to AG MATERIALS TECHNOLOGY CO., LTD., Hsinchu (TW)
Filed by AG MATERIALS TECHNOLOGY CO., LTD., Hsinchu (TW)
Filed on Mar. 18, 2022, as Appl. No. 17/699,048.
Claims priority of application No. 110126516 (TW), filed on Jul. 20, 2021.
Prior Publication US 2023/0027664 A1, Jan. 26, 2023
Int. Cl. H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/074 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13084 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13171 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/81201 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A bonding structure, comprising:
a first substrate;
a second substrate disposed opposite the first substrate;
a first bonding layer disposed on the first substrate;
a second bonding layer disposed on the second substrate and opposite the first bonding layer; and
a silver feature disposed between the first bonding layer and the second bonding layer, wherein the silver feature comprises a silver nano-twinned structure comprising parallel twin boundaries, wherein the parallel twin boundaries comprise 90% or more [111] crystal orientation.