US 12,148,715 B2
Electronic device including a substrate, a structure, and an adhesive and a process of forming the same
Roden Topacio, Springwater (CA)
Assigned to ATI Technologies ULC, Thornhill (CA)
Filed by ATI Technologies ULC, Markham (CA)
Filed on Dec. 10, 2021, as Appl. No. 17/643,698.
Prior Publication US 2023/0187379 A1, Jun. 15, 2023
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 24/73 (2013.01); H01L 2224/73204 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate;
an integrated circuit die attached to a surface of the substrate;
a structure having a first surface and a plurality of openings formed in the first surface to form respective cavities formed therein, wherein the first surface of the structure faces the surface of the substrate, wherein the openings are formed in a pre-determined pattern, and wherein the cavities are enclosed within the structure except for the openings formed in the first surface; and
an adhesive disposed between the surface of the substrate and the first surface of the structure and within at least a portion of the cavities.