US 12,148,674 B2
Substrate processing control using a measured size distribution of by-product particles
Jung Suk Goh, Hwaseong-si (KR); Young Dae Chung, Incheon (KR); and Ji Hoon Jeong, Hwaseong-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Apr. 7, 2021, as Appl. No. 17/224,658.
Claims priority of application No. 10-2020-0042396 (KR), filed on Apr. 7, 2020.
Prior Publication US 2021/0313239 A1, Oct. 7, 2021
Int. Cl. H01L 21/66 (2006.01); H01L 21/311 (2006.01)
CPC H01L 22/26 (2013.01) [H01L 21/31111 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate processing method comprising:
heating a processing liquid including a chemical liquid and water to a predetermined first temperature higher than a boiling point of the water;
heating a substrate to a predetermined second temperature higher than the boiling point of the water;
supplying the processing liquid heated to the predetermined first temperature on the substrate heated to the predetermined second temperature in order to etch a material on the substrate so that a liquid layer maintained by surface tension is formed on the substrate;
etching the material from the substrate using a chemical reaction between the material and the processing liquid;
measuring a size distribution of by-product particles on a surface of the substrate formed by the chemical reaction between the material and the processing liquid; and
controlling a supply of the processing liquid based on the size distribution of the by-product particles,
wherein the controlling the supply of the processing liquid includes:
calculating an average size of the by-product particles from the size distribution of the by-product particles on the surface of the substrate;
cooling the substrate to a temperature lower than the boiling point of the water when the average size of the by-product particles is greater than a predetermined first size and smaller than a predetermined second size; and
replenishing the water on the substrate cooled to the temperature lower than the boiling point of the water.