| CPC H01L 21/7684 (2013.01) [H01L 21/027 (2013.01); H01L 21/2885 (2013.01); H01L 21/4857 (2013.01); H01L 21/6838 (2013.01); H01L 22/12 (2013.01)] | 6 Claims |
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1. A method for manufacturing an electronic device, comprising:
setting a basic working area; and
performing a plurality of manufacturing processes on an object, the manufacturing processes comprising:
a photoresist coating process;
a development process;
an etching process;
an exposure process;
a metal plating process; and
a polishing process,
wherein for each of the plurality of manufacturing processes, a maximum optimized process area (MOPA) is defined as a maximum processing area on the object that a manufacturing process is capable of being processed in one process step, and a smallest one among the maximum optimized process areas of the manufacturing processes is selected as the basic working area,
wherein the MOPA of the photoresist coating process, the development process, the etching process and the metal plating process is an entire of the object, the MOPA of the exposure process is an exposable range for one shot of an exposure tool, the MOPA of the polishing process is determined by a polishing equipment, and
wherein a plurality of subsets is defined on the object by taking the basic working area as an area of each of the subsets, and one of the plurality of manufacturing processes is performed sequentially on each of the subsets.
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