US 12,148,650 B2
Thermal diffuser for a semiconductor wafer holder
Sanhong Zhang, Ballwin, MO (US); Kevin Ptasienski, O'Fallon, MO (US); Martin Wallinger, Abtenau (AT); and Blake Parkinson, St. Louis, MO (US)
Assigned to Watlow Electric Manufacturing Company, St. Louis, MO (US)
Filed by Watlow Electric Manufacturing Company, St. Louis, MO (US)
Filed on Nov. 9, 2022, as Appl. No. 17/983,643.
Application 17/983,643 is a continuation of application No. 16/552,790, filed on Aug. 27, 2019, granted, now 11,515,190.
Prior Publication US 2023/0139249 A1, May 4, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/683 (2006.01); C23C 24/04 (2006.01); H05B 3/14 (2006.01)
CPC H01L 21/6833 (2013.01) [C23C 24/04 (2013.01); H05B 3/146 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heating assembly comprising:
a support member for supporting a target thereon;
a diffuser layer attached to the support member, wherein the diffuser layer includes discrete diffuser segments separated by gaps, the gaps configured to thermally decouple the discrete diffuser segments; and
a heater attached to the diffuser layer and defining at least two heating zones which generate a predetermined thermal gradient,
wherein the discrete diffuser segments are made of the same material and correspond to the at least two heating zones, the gap being disposed immediately above a boundary between the at least two heating zones and thermally decoupling heat that is transferred to the at least two diffuser segments from the at least two heating zones such that the predetermined thermal gradient generated in the at least two heating zones is maintained in the diffuser layer during heating of the target.