US 12,148,644 B2
Laser irradiation apparatus
Yuki Suzuki, Yokohama (JP)
Assigned to JSW AKTINA SYSTEM CO., LTD, Yokohama (JP)
Filed by JSW AKTINA SYSTEM CO., LTD, Yokohama (JP)
Filed on May 9, 2023, as Appl. No. 18/195,069.
Application 18/195,069 is a division of application No. 16/321,017, granted, now 11,688,622, previously published as PCT/JP2017/021216, filed on Jun. 7, 2017.
Claims priority of application No. 2016-166962 (JP), filed on Aug. 29, 2016.
Prior Publication US 2023/0274964 A1, Aug. 31, 2023
Int. Cl. H01L 21/677 (2006.01); B23K 26/00 (2014.01); B23K 26/08 (2014.01); B23K 26/12 (2014.01); B23K 26/354 (2014.01); B65G 49/05 (2006.01); B65G 49/06 (2006.01); B65G 53/02 (2006.01); C03B 25/02 (2006.01); C03C 17/30 (2006.01); H01L 21/268 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67784 (2013.01) [B23K 26/0006 (2013.01); B23K 26/083 (2013.01); B23K 26/12 (2013.01); B23K 26/354 (2015.10); B65G 49/05 (2013.01); B65G 49/065 (2013.01); B65G 53/02 (2013.01); C03B 25/02 (2013.01); C03C 17/30 (2013.01); H01L 21/268 (2013.01); H01L 21/67115 (2013.01); H01L 21/6776 (2013.01); B65G 2249/04 (2013.01); B65G 2249/045 (2013.01); C03C 2218/32 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A laser irradiation apparatus comprising:
(a) a laser oscillator configured to emit a laser beam to be irradiated on a workpiece of a plate shape; and
(b) a flotation unit configured to float the workpiece by blowing and suctioning a gas, and including:
(b1) a base including a pressurizing through-hole and a depressurizing through-hole formed therein;
(b2) a porous plate located on an upper surface of the base and including a plurality of first through-holes formed therein; and
(b3) an intermediate plate made of a metal located below the porous plate, accommodated inside the base and including a plurality of second through-holes formed therein, wherein
the intermediate plate is shorter along a conveyance direction than the porous plate and the base,
the porous plate is bonded to the base by a first adhesive layer, and the intermediate plate is bonded to the base by a second adhesive layer,
the porous plate is disposed facing the workpiece,
a pressurizing chamber configured to pressurize a gas is formed in a space between the porous plate and the intermediate plate,
a depressurizing chamber configured to depressurize the gas is formed in a space between the base and the intermediate plate,
the pressurizing through-hole is connected to the pressurizing chamber,
each of the plurality of first through-holes is connected with a corresponding one of the plurality of second through-holes,
the depressurizing through-hole and the second through-holes are connected to the depressurizing chamber,
the gas is blown through the pressurizing through-hole and a pore of the porous plate,
the gas is suctioned through the depressurizing through-hole, and the pluralities of first and second through-holes, and
diameters of the plurality of first through-holes are larger than diameters of the plurality of second through-holes.