US 12,148,639 B2
Correcting target locations for temperature in semiconductor applications
Min-Yeong Moon, Ann Arbor, MI (US); Phalguna Kumar Rachinayani, Milpitas, CA (US); Jean-Christophe Perrin, Oakland, CA (US); and Stilian Pandev, Santa Clara, CA (US)
Assigned to KLA Corp., Milpitas, CA (US)
Filed by KLA Corporation, Milpitas, CA (US)
Filed on Oct. 3, 2022, as Appl. No. 17/959,008.
Prior Publication US 2024/0120221 A1, Apr. 11, 2024
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/67248 (2013.01) [H01L 22/12 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A system configured to determine information for a specimen, comprising:
an output acquisition subsystem configured to generate output for a specimen at one or more target locations on the specimen;
one or more temperature sensors configured to measure one or more temperatures within the output acquisition subsystem;
a computer subsystem configured to acquire the one or more measured temperatures from the one or more temperature sensors; and
one or more components executed by the computer subsystem;
wherein the one or more components comprise a deep learning model configured for predicting error in at least one of the one or more target locations based on at least one of the one or more measured temperatures input to the deep learning model by the computer subsystem, wherein the predicted error is defined as (1) a difference between an intended target location and a predicted location at which output generation is performed without any temperature-based correction or (2) a difference between a reported target location and an actual specimen position at which the output is predicted to have been generated; and
wherein the computer subsystem is further configured for determining a corrected target location for the at least one of the one or more target locations by applying the predicted error to the at least one of the one or more target locations.