US 12,148,633 B2
Plasma processing apparatus and method for releasing sample
Masaki Ishiguro, Tokyo (JP); and Masahiro Sumiya, Tokyo (JP)
Assigned to HITACHI HIGH-TECH CORPORATION, Tokyo (JP)
Filed by HITACHI HIGH-TECH CORPORATION, Tokyo (JP)
Filed on Sep. 30, 2020, as Appl. No. 17/038,072.
Application 17/038,072 is a division of application No. 15/425,155, filed on Feb. 6, 2017, granted, now 10,825,700.
Claims priority of application No. 2016-152424 (JP), filed on Aug. 3, 2016.
Prior Publication US 2021/0013060 A1, Jan. 14, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67069 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32532 (2013.01); H01J 37/32577 (2013.01); H01J 37/32715 (2013.01); H01J 37/32935 (2013.01); H01J 37/3299 (2013.01); H01L 21/6833 (2013.01); H01J 2237/334 (2013.01)] 1 Claim
OG exemplary drawing
 
1. A method for releasing a sample from a sample stage, in which the sample electrostatically adsorbed to the sample stage is subjected to a plasma processing and then released from the sample stage after the plasma processing, comprising:
generating a neutralization plasma;
changing a DC voltage applied to an electrode for the neutralization plasma from a predetermined value to 0 V after supplying of a radio frequency power to generate plasma is stopped and a predetermined time elapses,
wherein the predetermined time is 0.1 to 3 seconds, and
wherein the predetermined value is −10 to −20 V,
wherein the number of electrodes is two and a second electrode of the two electrodes is disposed concentrically with respect to a first electrode of the two electrodes, and
wherein the method further comprises applying the DC voltage to each of the two electrodes such that an average value of a DC voltage applied to the first electrode and a DC voltage applied to the second electrode becomes the predetermined value.