US 12,148,630 B2
Method for manufacturing electronic device
Yeong-E Chen, Miao-Li County (TW); Cheng-En Cheng, Miao-Li County (TW); Yu-Ting Liu, Miao-Li County (TW); and Cheng-Chi Wang, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Oct. 22, 2021, as Appl. No. 17/507,915.
Claims priority of application No. 202111031500.8 (CN), filed on Sep. 3, 2021.
Prior Publication US 2023/0077312 A1, Mar. 9, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/4857 (2013.01) [H01L 22/22 (2013.01); H01L 23/544 (2013.01); H01L 21/6835 (2013.01); H01L 2221/68345 (2013.01); H01L 2223/54426 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic device, comprising:
providing a carrier substrate;
forming a first base layer on the carrier substrate;
forming working units on the first base layer, wherein the working units are spaced apart from one another;
performing a detection step on the working units to identify whether a faulty working unit is present;
if a faulty working unit is identified, lifting off the faulty working unit from the carrier substrate;
repairing the faulty working unit to obtain a known good working unit; and
attaching the known good working unit to a position on the carrier substrate where the faulty working unit has been lifted off.