	US 12,148,601 B2
	Method of plasma processing a substrate in a plasma chamber and plasma processing system
Wojciech Gajewski, Warsaw (PL); Krzysztof Ruda, Zielonka (PL); and Jakub Swiatnicki, Zdunska Wola (PL)
Assigned to TRUMPF HUETTINGER SP. Z O. O., Zielonka (PL)
Filed by TRUMPF Huettinger Sp. z o. o., Zielonka (PL)
Filed on Mar. 18, 2022, as Appl. No. 17/697,965.
Application 17/697,965 is a continuation of application No. PCT/EP2020/076571, filed on Sep. 23, 2020.
Claims priority of application No. 19461583 (EP), filed on Sep. 23, 2019.
Prior Publication US 2022/0208532 A1, Jun. 30, 2022
Int. Cl. H01J 37/32 (2006.01); H01J 37/34 (2006.01)

CPC H01J 37/32944 (2013.01) [H01J 37/34 (2013.01); H01J 2237/332 (2013.01)]

21 Claims

1. A method of plasma processing a substrate in a plasma chamber, the method comprising:

supplying a power supply signal to electrodes arranged within the plasma chamber in order to form a plasma in the plasma chamber;

monitoring at least one parameter related to the plasma processing;

determining a feature related to the at least one monitored parameter; and

adjusting the power supply signal during the plasma processing to modify the feature,

wherein the modification of the feature eliminates or mitigates formation of crazing on the substrate.

16. A plasma processing system comprising:

a plasma chamber,

at least one electrode located inside the plasma chamber,

at least one power supply configured to supply a power supply signal to the at least one electrode in order to form a plasma in the plasma chamber,

at least one sensor for measuring at least one plasma process parameter related to a plasma processing of a substrate inside the plasma chamber,

at least one determination unit configured to determine a feature related to the at least one plasma process parameter of the plasma processing, and

a control unit for controlling the power supply in response to the feature, wherein the control unit is configured to adjust the power supply signal during the plasma processing such that the feature is modified so as to eliminate or mitigate formation of crazing on the substrate.