US 12,148,596 B2
High-frequency power supply device
Yuichi Hasegawa, Osaka (JP); and Yuya Ueno, Osaka (JP)
Assigned to DAIHEN Corporation, Osaka (JP)
Filed by DAIHEN Corporation, Osaka (JP)
Filed on Dec. 21, 2022, as Appl. No. 18/086,396.
Claims priority of application No. 2021-214971 (JP), filed on Dec. 28, 2021.
Prior Publication US 2023/0207270 A1, Jun. 29, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32183 (2013.01) [H01J 37/32165 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A high-frequency power supply device comprising:
a first power supply that supplies first high-frequency power to a load by outputting a first high-frequency voltage having a first fundamental frequency;
a second power supply that supplies second high-frequency power to the load by outputting a second high-frequency voltage having a second fundamental frequency lower than the first fundamental frequency;
a first matching unit connected between the first power supply and the load; and
a second matching unit connected between the second power supply and the load, wherein
the first matching unit performs a first matching operation of matching an impedance of the first power supply with an impedance of the load in a state in which intermodulation distortion occurs, the intermodulation distortion being caused by the first high-frequency power and the second high-frequency power being simultaneously supplied to the load, and
the first power supply performs frequency modulation control of frequency-modulating the first high-frequency voltage with a modulation signal having a same frequency as the second fundamental frequency and outputting it as a modulated wave after the first matching operation is completed.