US 12,148,574 B2
Multilayer capacitor and board having the same mounted thereon
San Kyeong, Suwon-si (KR); Chang Hak Choi, Suwon-si (KR); Jae Seok Yi, Suwon-si (KR); Bon Seok Koo, Suwon-si (KR); Jung Min Kim, Suwon-si (KR); Hae Sol Kang, Suwon-si (KR); and Jun Hyeon Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 30, 2023, as Appl. No. 18/239,911.
Application 18/239,911 is a continuation of application No. 17/836,383, filed on Jun. 9, 2022, granted, now 11,784,005.
Application 17/836,383 is a continuation of application No. 16/874,885, filed on May 15, 2020, granted, now 11,393,633, issued on Jul. 19, 2022.
Claims priority of application No. 10-2019-0103742 (KR), filed on Aug. 23, 2019.
Prior Publication US 2023/0402229 A1, Dec. 14, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a capacitor body including a dielectric layer and a plurality of internal electrodes; and
external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively,
wherein each of the external electrodes includes:
a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes;
a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of particles of a polymer material or of a resin-based material having a metal film disposed on a surface thereof, and a resin surrounding the plurality of metal particles and the plurality of particles of the polymer material or of the resin-based material; and
a plating layer covering the conductive resin layer,
wherein the metal particles of the conductive resin layer include a spherical or flake type powder particles,
wherein the multilayer capacitor further comprises an alloy, containing a material of the metal film and a material of the plurality of metal particles, being in direct contact with one of the particles of the polymer material or of the resin-based material and one of the plurality of metal particles.