US 12,148,571 B2
Mutilayer electronic component
SoEun Choi, Suwon-si (KR); KangHa Lee, Suwon-si (KR); BeomSuk Kang, Suwon-si (KR); JinSoo Park, Suwon-si (KR); and YoonA Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 26, 2022, as Appl. No. 17/952,511.
Claims priority of application No. 10-2021-0193707 (KR), filed on Dec. 31, 2021.
Prior Publication US 2023/0215638 A1, Jul. 6, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/232 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/30 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other a third direction;
a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface;
a first insulating layer disposed on the first connection portion;
a second insulating layer disposed on the second connection portion;
a first plating layer disposed on the first band portion; and
a second plating layer disposed on the second band portion,
wherein the first and second insulating layers include an oxide including silicon (Si), and
wherein, in the first and second insulating layers, a number of moles of Si atoms relative to a number of moles of elements other than oxygen is 0.95 or more.