US 12,148,570 B2
Multilayer electronic component
Min Jung Cho, Suwon-si (KR); Byung Kun Kim, Suwon-si (KR); and Yu Hong Oh, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 19, 2023, as Appl. No. 18/136,543.
Application 18/136,543 is a continuation of application No. 17/357,550, filed on Jun. 24, 2021, granted, now 11,664,162.
Claims priority of application No. 10-2020-0155482 (KR), filed on Nov. 19, 2020.
Prior Publication US 2023/0260701 A1, Aug. 17, 2023
Int. Cl. H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1218 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer electric component comprising:
a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and
external electrodes disposed on the body and connected to the internal electrodes,
wherein the internal electrodes are sintered and include Cu and Ni and a coefficient of variation (CV) value of Cu/Ni (percent by weight) in the internal electrodes is non-zero and 25.0% or less.