US 12,148,569 B2
Multilayer electronic component
Won Kuen Oh, Suwon-si (KR); Gyu Ho Yeon, Suwon-si (KR); Seo Won Jung, Suwon-si (KR); and Seo Ho Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 18, 2022, as Appl. No. 17/722,587.
Claims priority of application No. 10-2021-0193197 (KR), filed on Dec. 30, 2021.
Prior Publication US 2023/0215629 A1, Jul. 6, 2023
Int. Cl. H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/008 (2013.01) [H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/30 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween;
a first external electrode disposed on the body and connected to the first internal electrode; and
a second external electrode disposed on the body and connected to the second internal electrode,
wherein the first and second external electrodes include;
a first electrode layer disposed on the body and including one or more of copper (Cu), nickel (Ni), and alloys thereof, and
a second electrode layer disposed on the first electrode layer, including silver (Ag), a copper (Cu)-palladium (Pd) alloy and one or more of palladium (Pd), platinum (Pt), and gold (Au),
wherein the first electrode layer is substantially free of glass, and
a content of the copper (Cu)-palladium (Pd) alloy increases from an outer surface of the second electrode layer to an interface between the second electrode layer and the first electrode layer.