US 12,148,542 B2
Purification process for the preparation of non-carrier added copper-64
David Pipes, St. Louis, MO (US); Lauren Radford, St. Louis, MO (US); William Uhland, St. Louis, MO (US); Brian Regna, St. Louis, MO (US); and Craig Brunkhorst, St. Louis, MO (US)
Assigned to CURIUM US LLC, St. Louis, MO (US)
Filed by Curium US LLC, St. Louis, MO (US)
Filed on Aug. 28, 2023, as Appl. No. 18/238,951.
Application 18/238,951 is a continuation of application No. 17/993,186, filed on Nov. 23, 2022, granted, now 11,798,701.
Application 17/993,186 is a continuation of application No. 17/894,874, filed on Aug. 24, 2022, granted, now 11,581,103, issued on Feb. 14, 2023.
Application 17/894,874 is a continuation of application No. 17/466,443, filed on Sep. 3, 2021, granted, now 11,521,762, issued on Dec. 6, 2022.
Claims priority of provisional application 63/074,356, filed on Sep. 3, 2020.
Prior Publication US 2023/0420152 A1, Dec. 28, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G21G 1/00 (2006.01); A61K 51/04 (2006.01); C01G 3/00 (2006.01); G21G 1/10 (2006.01); G21G 4/08 (2006.01)
CPC G21G 1/001 (2013.01) [A61K 51/0482 (2013.01); C01G 3/003 (2013.01); G21G 1/10 (2013.01); G21G 4/08 (2013.01); G21G 2001/0094 (2013.01)] 25 Claims
 
1. A composition comprising a bombarded target comprising from 38 Ci to 52 Ci of copper-64 (64Cu) at the end of bombardment (EOB) wherein the composition has a specific activity from about 100 mCi 64Cu/μg Cu to about 3800 mCi 64Cu/μg Cu at the end of bombardment.