US 12,148,376 B2
Display substrate, manufacturing method thereof, and display apparatus
Xiaoqing Shu, Beijing (CN); Bo Zhang, Beijing (CN); Rong Wang, Beijing (CN); Hongwei Ma, Beijing (CN); and Xiangdan Dong, Beijing (CN)
Assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/916,101
Filed by CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed May 31, 2021, PCT No. PCT/CN2021/097532
§ 371(c)(1), (2) Date Sep. 30, 2022,
PCT Pub. No. WO2022/252094, PCT Pub. Date Dec. 8, 2022.
Prior Publication US 2023/0306903 A1, Sep. 28, 2023
Int. Cl. G09G 3/3233 (2016.01); H01L 27/02 (2006.01); H10K 59/121 (2023.01); H10K 59/131 (2023.01)
CPC G09G 3/3233 (2013.01) [H01L 27/0248 (2013.01); H10K 59/1213 (2023.02); H10K 59/1315 (2023.02); G09G 2310/0286 (2013.01); G09G 2330/06 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A display substrate, comprising a display region, a non-display region, and an extension part, wherein the display region comprises a display pixel, and the non-display region at least partially surrounds the display region; the display substrate comprises:
a substrate which is in the display region, the non-display region and the extension part and comprises a bendable part at an edge of the non-display region away from the display region, wherein the display substrate has a first side and a second side opposite to the first side, the extension part is connected with the bendable part and is able to be bent to the second side of the display substrate through the bendable part;
a first insulation layer, wherein at least a part of the first insulation layer is in the extension part and the first insulation layer comprises an opening; and
an electrically conductive structure, on the extension part and comprising:
a lower part, wherein the opening exposes at least part of the lower part;
an upper part, on a side of the lower part away from the substrate, wherein at least a part of the upper part is in the opening and is in direct contact with the lower part; and
the display substrate further comprises:
a pixel circuit, in the display region and configured to control a display state of the display pixel;
a driving circuit, wherein at least a part of the driving circuit is in the non-display region, the driving circuit comprises a driving signal line that is at least partially located in the non-display region, and the driving signal line is configured that a driving signal is provided to the pixel circuit;
a detection lead wire, electrically connected to the driving signal line and configured to provide a detection signal to the driving signal line, wherein the detection lead wire extends from the non-display region of the display substrate to the extension part of the display substrate region by passing through the bendable part;
an integrated circuit board, in the extension part and configured to provide the driving signal to the driving circuit;
a first pin, wherein the electrically conductive structure comprises the first pin, the integrated circuit board is provided with an integrated circuit board pin, the integrated circuit board is bonded to a region where the first pin is located, and an upper surface of the first pin which is away from the substrate is in direct contact with the integrated circuit board pin;
a flexible circuit board, in the extension part, wherein at least part of the flexible circuit board is connected to the detection lead wire and configured to provide the detection signal to the detection lead wire, and the flexible circuit board is connected to the integrated circuit board and configured to provide the integrated circuit board with an electrical signal for generating the driving signal; and the integrated circuit board is on a side of the flexible circuit board close to the bendable part;
the lower part comprises a first lower part, the first lower part comprises a second sub-lower part, the opening comprises a first opening, the first opening comprises a second sub-opening, and the second sub-opening exposes at least part of the second sub-lower part;
the upper part comprises a first upper part, the first upper part comprises a second sub-upper part, the second sub-upper part is stacked with the second sub-lower part in the direction perpendicular to the substrate and is on a side of the second sub-lower part away from the substrate, at least a part of the second sub-upper part is in the second sub-opening and is in direct contact with the second sub-lower part;
the extension part has an edge opposite to the bendable part and extending along a first direction, a second direction is in the same plane as the first direction and intersects with the first direction, the detection lead wire is on at least one side of the integrated circuit board in the first direction, and the detection lead wire comprises a first detection lead wire closest to the integrated circuit board in the first direction, the first detection lead wire has an overlapping portion overlapping with the first pin in the second direction, the overlapping portion is between the flexible circuit board and the first pin in the second direction, and the overlapping portion comprises the second sub-lower part and the second sub-upper part; the first detection lead wire comprises an inclined portion intersecting with the first direction, and the inclined portion comprises the overlapping portion.