US 12,148,337 B2
Chip on film package with trench to reduce slippage and display device including the same
Sanguk Han, Asan-si (KR); Jaemin Jung, Seoul (KR); Jeongkyu Ha, Hwaseong-si (KR); and Kwanjai Lee, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 24, 2022, as Appl. No. 17/679,587.
Claims priority of application No. 10-2021-0101525 (KR), filed on Aug. 2, 2021.
Prior Publication US 2023/0036519 A1, Feb. 2, 2023
Int. Cl. H01L 23/532 (2006.01); G09G 3/20 (2006.01); H01L 23/00 (2006.01)
CPC G09G 3/20 (2013.01) [H01L 23/53209 (2013.01); H01L 23/53271 (2013.01); H01L 24/10 (2013.01); G09G 2300/0408 (2013.01); G09G 2300/0426 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chip on film package comprising:
a film substrate comprising a base film, a conductive pad extending in a first direction on the base film, and a conductive line pattern extending from the conductive pad;
a semiconductor chip provided on the film substrate; and
a bump structure provided between the semiconductor chip and the conductive pad,
wherein a first peripheral wall and a second peripheral wall of the bump structure extend in the first direction and define a trench, wherein a portion of the conductive pad that is provided in the trench is in contact with the bump structure, and
wherein the conductive pad is spaced apart from at least one of the first peripheral wall and the second peripheral wall.