US 12,148,236 B2
Optical sensor and methods of making the same
You-Cheng Jhang, Hsinchu (TW); Han-Zong Pan, Hsinchu (TW); Wei-Ding Wu, Zhubei (TW); Jiu-Chun Weng, Taipei (TW); Hsin-Yu Chen, Hsinchu (TW); Cheng-San Chou, Hsin-Chu (TW); and Chin-Min Lin, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 10, 2023, as Appl. No. 18/232,756.
Application 18/232,756 is a continuation of application No. 17/993,319, filed on Nov. 23, 2022.
Application 17/993,319 is a continuation of application No. 16/869,314, filed on May 7, 2020, granted, now 11,514,707.
Claims priority of provisional application 62/855,545, filed on May 31, 2019.
Prior Publication US 2023/0401885 A1, Dec. 14, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06V 40/13 (2022.01); G02B 27/30 (2006.01); G06F 3/041 (2006.01); G06F 21/32 (2013.01); H01L 27/146 (2006.01)
CPC G06V 40/13 (2022.01) [G02B 27/30 (2013.01); G06F 3/0412 (2013.01); G06F 21/32 (2013.01); H01L 27/14625 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sensing apparatus, comprising:
an image sensor;
a collimator above the image sensor, wherein the collimator includes an array of apertures;
an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures, wherein the optical filtering layer extends continuously directly above the collimator and has an opening outside of the collimator; and
a conductive feature coupled to the image sensor, wherein the conductive feature extends through the opening.