US 12,148,149 B2
Training a machine learning system to detect an excursion of a CMP component using time-based sequence of images
Sidney P. Huey, Fremont, CA (US); Thomas Li, Santa Clara, CA (US); and Benjamin Cherian, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 6, 2023, as Appl. No. 18/206,353.
Application 18/206,353 is a continuation of application No. 17/678,939, filed on Feb. 23, 2022, granted, now 11,710,228.
Claims priority of provisional application 63/157,616, filed on Mar. 5, 2021.
Prior Publication US 2023/0316502 A1, Oct. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06T 7/00 (2017.01); B24B 37/005 (2012.01); G06T 7/20 (2017.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); H01L 21/66 (2006.01); H04N 5/272 (2006.01); H04N 7/18 (2006.01)
CPC G06T 7/001 (2013.01) [B24B 37/005 (2013.01); G06T 7/20 (2013.01); H04N 5/272 (2013.01); H04N 7/18 (2013.01); G06T 2207/10016 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30232 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 22/12 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A polishing system, comprising:
a platen to support a polishing pad;
a carrier head to hold a substrate against the polishing pad;
a component selected from a group including the platen, the carrier head, a conditioner arm, a load cup, or a robot arm;
a camera positioned to capture a time-based sequence of monitoring images of the component; and
a controller configured to
cause the component to perform operations in accord with a reference recipe,
receive from the camera a time-based sequence of training images of the component performing the operations, and
train a machine learning model using the training images to detect and indicate excursions of the component from expected operations.