US 12,147,741 B1
Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model
Cheng-Tang Wu, Livermore, CA (US); Wei Hu, Mountain View, CA (US); Dandan Lyu, Dublin, CA (US); Siddharth Shah, Irvine, CA (US); and Ashutosh Srivastava, Mountain View, CA (US)
Assigned to ANSYS, INC., Canonsburg, PA (US)
Filed by ANSYS, Inc., Canonsburg, PA (US)
Filed on Jun. 20, 2023, as Appl. No. 18/338,214.
Application 18/338,214 is a continuation of application No. 17/084,367, filed on Oct. 29, 2020, granted, now 11,720,726.
Claims priority of provisional application 63/056,418, filed on Jul. 24, 2020.
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 30/20 (2020.01); G06F 30/25 (2020.01); G06F 30/28 (2020.01); G06F 111/00 (2020.01); G06F 111/04 (2020.01); G06F 115/12 (2020.01); G06F 119/02 (2020.01); G06F 119/22 (2020.01)
CPC G06F 30/20 (2020.01) [G06F 30/25 (2020.01); G06F 30/28 (2020.01); G06F 2111/00 (2020.01); G06F 2111/04 (2020.01); G06F 2115/12 (2020.01); G06F 2119/02 (2020.01); G06F 2119/22 (2020.01)] 20 Claims
OG exemplary drawing
 
1. A computer-implemented method comprising:
(a) receiving a computer aided engineering (CAE) model for representing a product that contains a solder structure;
(b) generating a solder structure model to represent the solder structure, wherein the solder structure model is associated with the CAE model; and
(c) performing a simulation of physical behaviors of the product using the CAE model in a first time scale and the solder structure model in a second time scale, comprising:
(i) simulating the CAE model with a first time step of the first time scale;
(ii) simulating the solder structure model with a second time step of the second time scale, wherein the first time step is different than the second time step; and
(iii) periodically synchronizing a set of constraints between the CAE model and the solder structure model.