US 12,147,129 B2
Display device
Hideki Shiina, Tokyo (JP)
Assigned to JAPAN DISPLAY INC., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on May 5, 2023, as Appl. No. 18/312,594.
Application 18/312,594 is a continuation of application No. 17/861,255, filed on Jul. 11, 2022, granted, now 11,681,186.
Application 17/861,255 is a continuation of application No. 17/020,864, filed on Sep. 15, 2020, granted, now 11,415,845, issued on Aug. 16, 2022.
Application 17/020,864 is a continuation of application No. PCT/JP2019/002355, filed on Jan. 24, 2019.
Claims priority of application No. 2018-058620 (JP), filed on Mar. 26, 2018.
Prior Publication US 2023/0273485 A1, Aug. 31, 2023
Int. Cl. G02F 1/1345 (2006.01); G02F 1/1333 (2006.01); G02F 1/1343 (2006.01); G02F 1/1362 (2006.01); G02F 1/1368 (2006.01); G06F 3/041 (2006.01); H01L 27/12 (2006.01); G06F 3/044 (2006.01)
CPC G02F 1/13458 (2013.01) [G02F 1/133345 (2013.01); G02F 1/13439 (2013.01); G02F 1/136286 (2013.01); G02F 1/1368 (2013.01); G06F 3/0412 (2013.01); H01L 27/124 (2013.01); G02F 1/13338 (2013.01); G02F 2201/123 (2013.01); G06F 3/04164 (2019.05); G06F 3/044 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A display device comprising:
a first substrate comprising a first area and a second area;
a second substrate comprising a substrate end portion located at a boundary between the first area and the second area, and overlapping the first area; and
a connection member, wherein
the first substrate comprises a pad portion, a terminal, and a wiring line connecting the pad portion and the terminal, in the second area,
the second substrate comprises a first transparent conductive film located on an outer surface of a side opposite to an inner surface opposed to the first substrate,
the pad portion comprises a second transparent conductive film and an insulating film,
the connection member connects the first transparent conductive film and the second transparent conductive film,
the second transparent conductive film is connected to the wiring line via a plurality of first contact holes formed in the insulating film,
the plurality of first contact holes is arrayed in a matrix in a first direction and a second direction intersecting the first direction, in a plan view,
the plurality of first contact holes are arrayed in at least two columns in the first direction and are arrayed in at least four rows in the second direction,
the first substrate comprises scanning lines arrayed in the second direction, signal lines arrayed in the first direction, sensor electrodes arrayed in a matrix in the first direction and the second direction, and sensor lines arrayed in the first direction, in the first area,
the insulating film has a top surface and a bottom surface,
the sensor electrodes contact the top surface of the insulating film, in the first area, and
the second transparent conductive film of the pad portion contacts the top surface of the insulating film, in the second area.