US 12,147,084 B2
Cooling device, a receptacle assembly, a system and a printed board assembly
Mikkel Myhre, Järfälla (SE); Samir Saaidi, Stockholm (SE); and Gustav Lundmark, Sigtuna (SE)
Assigned to Telefonaktiebolaget LM Ericsson (publ), Stockholm (SE)
Appl. No. 17/597,618
Filed by Telefonaktiebolaget LM Ericsson (publ), Stockholm (SE)
PCT Filed Jul. 16, 2019, PCT No. PCT/SE2019/050696
§ 371(c)(1), (2) Date Jan. 14, 2022,
PCT Pub. No. WO2021/010874, PCT Pub. Date Jan. 21, 2021.
Prior Publication US 2022/0252800 A1, Aug. 11, 2022
Int. Cl. G02B 6/42 (2006.01); H05K 7/20 (2006.01)
CPC G02B 6/4269 (2013.01) [H05K 7/20336 (2013.01); H05K 7/2039 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A cooling device for cooling a heat generating component, wherein the cooling device comprises a heat sink and a heat pipe that is in thermal contact with the heat sink, wherein the heat pipe comprises a first portion having a thermal contact area that is in thermal contact with the heat generating component, a second portion that is in thermal contact with the heat sink, and a third portion that is disposed to reside between ends of the second portion and connected to the first portion, and the third portion to reside between the first portion and the second portion, and wherein the heat pipe is made of flexible material and configured in a shape that provides elastic energy storage properties and without use of a mechanical assisting device between the heat pipe and the heat sink.