US 12,147,083 B2
Hybrid manufacturing for integrating photonic and electronic components
Abhishek A. Sharma, Hillsboro, OR (US); Wilfred Gomes, Portland, OR (US); and Mauro J. Kobrinsky, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 16, 2020, as Appl. No. 17/123,787.
Prior Publication US 2022/0187536 A1, Jun. 16, 2022
Int. Cl. G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/13 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/42 (2013.01) [G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); G02B 2006/12142 (2013.01); G02B 6/13 (2013.01); H01L 25/167 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a first integrated circuit (IC) structure, comprising first electrically conductive interconnects and a first optical waveguide;
a second IC structure, comprising second electrically conductive interconnects and a second optical waveguide, the second IC structure attached to the first IC structure; and
a bonding material in at least portions of a bonding interface where the second IC structure is attached to the first IC structure, the bonding material including silicon, nitrogen, and carbon,
wherein at least a portion of the first optical waveguide overlaps, and is in contact with, at least a portion of the second optical waveguide.