US 12,147,073 B1
Co-packaging photonic integrated circuits and application specific integrated circuits
Christopher Doerr, Middletown, NJ (US); Eric Swanson, Gloucester, MA (US); Diedrik Vermeulen, Somerville, MA (US); Saeid Azemati, Newton, MA (US); and Jon Stahl, Wayland, MA (US)
Assigned to ACACIA COMMUNICATIONS, INC., Maynard, MA (US)
Filed by Acacia Communications, Inc., Maynard, MA (US)
Filed on Feb. 26, 2020, as Appl. No. 16/801,789.
Application 16/801,789 is a continuation of application No. 15/870,468, filed on Jan. 12, 2018, granted, now 10,578,799.
Application 15/870,468 is a continuation of application No. 13/871,331, filed on Apr. 26, 2013, granted, now 9,874,688, issued on Jan. 23, 2018.
Claims priority of provisional application 61/638,658, filed on Apr. 26, 2012.
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 6/42 (2006.01); G02B 6/12 (2006.01)
CPC G02B 6/12 (2013.01) [G02B 6/4269 (2013.01); G02B 6/428 (2013.01); H01L 2224/16225 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A co-packaging arrangement comprising:
a photonic integrated circuit (PIC) and an application specific integrated circuit (ASIC), wherein the PIC and the ASIC are disposed on a substrate within a housing;
wherein said PIC is coupled to at least two optical fibers that couple light between structures outside the housing to optical waveguides on the PIC,
wherein said PIC includes one or more optical modulators and one or more optical detectors and said substrate includes electrical interconnects for interconnecting the PIC to the ASIC; and
wherein the one or more optical modulators are driven by a driver driven from a digital-to-analog converter (DAC) that is part of the ASIC.