US 12,146,800 B2
Temperature sensor and device equipped with temperature sensor
Toshiyuki Nojiri, Tokyo (JP)
Assigned to SEMITEC Corporation, Tokyo (JP)
Appl. No. 17/265,513
Filed by SEMITEC Corporation, Tokyo (JP)
PCT Filed Aug. 6, 2019, PCT No. PCT/JP2019/030893
§ 371(c)(1), (2) Date Feb. 2, 2021,
PCT Pub. No. WO2020/032021, PCT Pub. Date Feb. 13, 2020.
Claims priority of application No. 2018-152022 (JP), filed on Aug. 10, 2018.
Prior Publication US 2021/0223114 A1, Jul. 22, 2021
Int. Cl. G01K 7/22 (2006.01); G01K 1/20 (2006.01); H01C 7/00 (2006.01)
CPC G01K 7/22 (2013.01) [G01K 1/20 (2013.01); H01C 7/006 (2013.01); H01C 7/008 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A temperature sensor comprising:
a heat sensitive element having an insulating substrate, a heat sensitive film formed on the insulating substrate, and an electrode layer formed on the insulating substrate and electrically connected to the heat sensitive film;
a lead member having a joint part electrically connected to the electrode layer by being joined to the electrode layer by means of welding and a lead part integrally extending from the joint part; and
a pair of insulating films sandwiching and sealing at least the heat sensitive element and the joint part of the lead member from both sides,
the pair of insulating films at least having a pair of substrate layers made of thermosetting resin, and a heat fusion layer made of thermosetting resin between at least inner sides of the substrate layers to sandwich and seal at least the heat sensitive element and the joint part of the lead member from both sides,
the substrate layers in a stable state after a heat reaction, and the heat fusion layer is thermally reactive layer.