US 12,146,795 B2
Temperature monitoring
David Michael French, Fort Myers, FL (US); Christopher-James Parker, Beaverton, OR (US); Keith Joseph Batryn, Wilsonville, OR (US); and Dirk Rudolph, Dundee, OR (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Appl. No. 17/777,738
Filed by Lam Research Corporation, Fremont, CA (US)
PCT Filed Nov. 11, 2020, PCT No. PCT/US2020/060023
§ 371(c)(1), (2) Date May 18, 2022,
PCT Pub. No. WO2021/101772, PCT Pub. Date May 27, 2021.
Claims priority of provisional application 62/937,739, filed on Nov. 19, 2019.
Prior Publication US 2022/0404208 A1, Dec. 22, 2022
Int. Cl. G01J 5/061 (2022.01); G01J 5/10 (2006.01)
CPC G01J 5/061 (2013.01) [G01J 5/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A temperature control system comprising:
an array sensor to generate a two-dimensional image, the two-dimensional image including one or more zones, each zone of the one or more zones corresponding to a respective component among a plurality of components of a printed circuit board (PCB) and comprising a plurality of pixels indicative of temperatures of the respective component;
a controller controlling a heating device and a cooling device to adjust the temperatures of the plurality of components; and
an array sensor controller activated by a power source and in communication with the array sensor and the controller.