US 12,146,710 B2
Substrate treating apparatus and substrate treating system comprising the same
Young Je Um, Busan (KR); Joun Taek Koo, Seoul (KR); Wan Jae Park, Gyeonggi-do (KR); Dong Hun Kim, Seoul (KR); Seong Gil Lee, Gyeonggi-do (KR); Ji Hwan Lee, Incheon (KR); Dong Sub Oh, Busan (KR); Myoung Sub Noh, Gyeonggi-do (KR); and Du Ri Kim, Incheon (KR)
Assigned to SEMES Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES Co., Ltd., Chungcheongnam-do (KR)
Filed on Jul. 2, 2021, as Appl. No. 17/366,247.
Claims priority of application No. 10-2020-0120391 (KR), filed on Sep. 18, 2020.
Prior Publication US 2022/0090861 A1, Mar. 24, 2022
Int. Cl. F27B 9/02 (2006.01); F27B 17/00 (2006.01)
CPC F27B 9/028 (2013.01) [F27B 9/029 (2013.01); F27B 17/0025 (2013.01); F27B 2009/026 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for configuring a substrate treating apparatus, the apparatus comprising:
a first chamber heat-treating a substrate; and
a second chamber treating the substrate in another way different from heat-treatment, the method comprising:
varying a number of the first chambers depending on a number of the second chambers that need heat treatment for the substrate, and
determining the number of the second chambers that need heat treatment for the substrate depending on whether process by-products are generated when the substrate is treated in the second chambers, such that heat treatment is needed for the second chambers in which process by-products are generated, and heat treatment is not needed for the second chambers in which process by-products are not generated.