US 12,146,476 B2
Flexible vapor chamber with shape memory material
Jeff Ku, Taipei (TW); Mark J. Gallina, Hillsboro, OR (US); Min Suet Lim, Penang (MY); and Jianfang Zhu, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 23, 2021, as Appl. No. 17/561,605.
Prior Publication US 2022/0186716 A1, Jun. 16, 2022
Int. Cl. H05K 7/20 (2006.01); F03G 7/06 (2006.01)
CPC F03G 7/0614 (2021.08) [H05K 7/20336 (2013.01); H05K 7/20318 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic device comprising:
one or more heat sources;
a flexible vapor chamber in thermal proximity to the one or more heat sources;
shape memory material;
a chassis, wherein when the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a location that is on or approximately on the chassis to help dissipate heat from the one or more heat sources collected by the flexible vapor chamber to the chassis; and
an activator, wherein the activator activates the shape memory material.